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High-Speed Computing Board Design

Modules & Sub Modules

Training Days

M1: Analog Circuit Design

  • Passive circuit components and their practical characteristics
  • Review of commonly encountered terminologies
  • Response of basic circuits in time domain and frequency domain
  • Practical circuit analysis and design techniques
  • Semiconductor components and characteristics
  • Passive semiconductor circuits and applications
  • Semiconductor components and characteristics
  • Single transistor amplifier
  • Amplifier small signal analysis
  • Amplifier output stages
  • Amplifier frequency response
  • Wide bandwidth amplifier
  • Mini Project 1: BJT amplifier design
  • Opamp characteristics
  • Feedback control operation
  • Common op-amp circuits and applications
  • Mini Project 2: Design of op-amp based Voltage regulator

5 days

M2: Practical PCB Layout Design Techniques

  • Overview of PCB terminology
  • Assumptions often made about PCB and components
  • Real behaviours of the PCB and components
  • Schematics vs. PCB layout
  • Analogue vs. digital vs. RF
  • PCB material
  • Single-sided, double-side and multilayer PCBs
  • Short trace vs. long trace
  • Creating appropriate stack-up configuration
  • Signal classification and circuit partitioning in PCB
  • Type of signal topologies
  • Decoupling capacitors, power & ground planes, power supply
  • Noise management
  • PCB design process
  • Layout techniques for analog & digital signals
  • Layout techniques for differential signals
  • Layout techniques for high-speed memory
  • Layout techniques for RF circuits

3 days

M3: High-Speed PCB Design

  • Review of PCB Interconnect Structures and Component Packaging
  • Introduction to Signal Integrity
  • Transmission Line and Signal Propagation
  • Signal Return Path and EMI
  • PCB Stack-up
  • Differential Signaling
  • Hands-on Session: Demonstrating SI issues via simulation/measurement
  • Simultaneous Switching Noise (SSN) and Ground Bounce
  • Decoupling Capacitors
  • Quality high-speed PCB Design Procedure
  • Hands-on Session: Demonstrating SI issues via simulation/measurement

3 days

M4: Signal Integrity (SI) Measurement Techniques for High-Speed Digital Circuits

  • Digital Communication Market Segments
  • Signal Distortion Mechanisms on High Speed Digital I/O
  • Signal Integrity Measurements

3 days

M5: USB and Ethernet Interfacing for High-Speed Computing

  • Ethernet protocol, MAC layer and physical layer interface, TCP, DNS, HTTP, SMTP, TELNET, LAN
  • USB transactions, enumeration process, plug and play, USB 2.0, system development issues, debugging and development tools

2 days

M6: DRAM Technologies and Operations

  • Overview of PC system architecture and memory technologies
  • Internal operation of DRAM
  • Overview of asynchronous DRAMs' operation and their deficiencies
  • SDR SDRAM devices and operations
  • SDR basic read write cycles
  • SDRAM interfacing signals and mode register
  • SDRAM commands and initialization
  • Memory modules organization
  • Low power DRAM
  • DDR and DDR2 SDRAM devices and operations
  • Comparison between SDRAM and DDR SDRAM (functions, specification, commands, interface signals and timing)
  • Signal integrity and termination requirements
  • ODT and OCD features
  • DDR3 new features (fly-by topology, write leveling and driver calibration)
  • Power management consideration
  • Memory controller design and interfacing issues
  • GDDR overview and its unique features

2 days

M5: Practical EMC Design with Controlled Conducted and Radiated Emissions

  • Introduction
  • EMI Noise Sources
  • Conducted Emissions
  • Radiated Emissions

2 days