LED Devices and Process Technologies

Modules & Sub Modules	Training Days
M1: LED device and technology Semiconductor materials Band-gap energy MOCVD Process Device structure Epitaxial fabrication Wafer fabrication Electrical and Photometric Characteristics Device efficiency Light extraction techniques	3 days
M2: LED Color Science / Illumination Engineering Photometric quantities o Candela, lumen, nits, lux etc Colorimetric quantities o Dominant wavelength o (x,y) coordinates Color Space o (x,y), (u,v) etc Color Rendering Index Color Mixing Theory o Understanding Tristimulus values o Mixing two colors o Mixing three or more colors	2 days
M3: LED Packaging – Design and Material Selection LED Construction Substrates – Leadframe, PCBs, et c Die types Encapsulants – Epoxy, Silicones, etc Interconnects o Gold Wire o Die-attach o Eutetics Through Hole LEDs Surface Mount LEDs High Power LEDs Stress and Strain Analysis Design Software Reliability	2 days
M4: LED Applications Indicators Displays Backlighting Full Color Video Screen Solid State Lighting/Illumination LED Drivers – Design and Technologies Thermal Management Considerations Regulations and Standards for LED lamps and luminaire o US Energy Star o UL o Ingress Protection (IP) Rating o LM-78, 79 and 80.	2 days
M5: LED Manufacturing Processes LED piece-parts Processes for SMT, TH, and Power LEDs Die-Attach Wire-bond Encapsulation Singulation Photomteric Tests Reliability Tests Tape and Reel Shipping Tubes ESD Precautions Moisture Sensitivity Levels	3 days
M6: LED Optics, Design and Applications Behaviour of Light Reflection, Diffused and Specular Refraction – Snell’s Law Diffraction Diffusion Collimation Filters and Filtering Transmissivity of materials Total Internal Reflection in LEDs Optical Lenses Radiation pattern of LEDs Near Field and Far Field patterns Street lamp beam patterns LCD Backlighting lighting Camera Flash Optics Optical materials and properties Factors affecting degradation of optical materials	3 days